翻譯資格考試中級英語筆譯詞匯：生產(chǎn)流程
Manufacturing Process 生產(chǎn)流程
Printed Circuit Board Process Flowchart 流程圖
i) inneriayer 內(nèi)層
1. Chemical Cleaning: Removes the anti-tarnish coating, dirt, grease, from the copper ciad laminate.
化學(xué)清洗：去除銅箔面上的氧化層、不光澤物、污物和油脂。
2. Dry Film Lamination: Application of an UV sensitive film to the cleaned surface of the copper laminate through controlled heat and pressure. The line includes material surface preparation, CSL, loader and Stacker.
在清潔的覆銅板兩面貼上一層UV光敏材料―――干膜、貼膜通常在全自動貼膜機上完成，在加熱加壓的條件下將干膜粘貼在覆銅板面上。干膜中的抗蝕劑層受熱后變軟，流動性增加，借助于熱壓輥的壓力和抗蝕劑粘結(jié)劑的作用完成貼膜。
3. Dry Film Exposure: A negative phototool or artwork is imaged into the dry film, on both sides of the copper clad, through UV light exposure leaving a positive image in the dry film.
During exposure the UV energy is absorbed by the dry film directly underneath the clear areas of the overlaying artwork, causing it to polymerize and harden. The film covered by dark areas of the artwork remains soft.
曝光：將負(fù)片底片覆蓋在覆銅板兩面，經(jīng)過紫外光照射曝光后在干膜上產(chǎn)生正片圖像。
曝光過程是在紫外光照射下，未被底片擋住部分的干膜中的光引發(fā)劑吸收光能分解成洲離基，游離基再引發(fā)聚合單體進行交聯(lián)反應(yīng)，反應(yīng)后生成不溶于稀堿溶液的體形大分子結(jié)構(gòu)人。
4. Dry Film Developing: After the dry film is imaged, the unexposed soft areas of the film are dissolved away while the hardened dry film remains unaffected.
顯影：干膜中未曝光部分的活性基因與稀堿溶液反應(yīng)生成可溶性物質(zhì)而溶解下來，曝光部分的干膜不被溶解。
5. Copper Etch: The remaining hardened dry film on the copper acts as a “Resist” and the unprotected copper is chemically dissolved or etched.
蝕刻：保護性的干膜再覆銅板上形成圖像，那些顯影掉，未被干膜保護的不需要的銅膜，在化學(xué)蝕刻工序中被蝕刻掉。
6. Strip Resist: The hardened dry film is stripped from the copper leaving the desired copper pattern reproduced from the artwork. The lnner-layer image transfer process has been completed.
去膜：蝕刻后將抗蝕層干膜去除，得到所需的裸銅電路圖圖。內(nèi)層圖形轉(zhuǎn)移過程就這樣完成了。
7. Post-Etch-Punch(PEP): This process punches tooling holes which are used to align inner-layer cores in subsequent processes.
沖孔：沖孔機沖的孔用于下工序內(nèi)層定位。沖孔機利用帶靶形的攝像系統(tǒng)在銅板上定位，沖出的孔有非常高的精確度。
8. Automated Optical Inspection (AOI)： lnner-layer cores are inspected with the use of a comouter aided optical inspection system to locate any pattern defect that may have occurred during the image transfer process.
The AOI process uses a datafile generated at CAM, the machine compares the image scaned versus a graphic computer file. AOI benefits consist of early detection of process deviations, reduction of finat test fallout’s, consistent line width and tolerances. Repairs can be made here to weld innerlayer opens or trim innerlayer shorts per customer specifications.
自動光學(xué)檢測(AOI)：AOI機主要利用電腦輔助光學(xué)系統(tǒng)檢測內(nèi)層光成像中產(chǎn)生的缺陷。
AOI用計算機制作數(shù)據(jù)測試文件，將掃描的圖形與計算機圖解文件時行對照，AOI的優(yōu)點在于盡早檢測出內(nèi)層產(chǎn)生的偏差、線寬公差、減少最終檢驗報廢，檢測出的內(nèi)層/短路可進行返修。
Critical Factors for Fine Line Resolution 細(xì)線路生產(chǎn)影響因素
·Tightly controlled clean room temperature and relative humidity
嚴(yán)格控制室內(nèi)的溫度與相對濕度
·Room and equipment cleanliness 保持室內(nèi)與設(shè)備清潔無塵
·Collimated light sources 曝光機紫外光光源平行
·Total UV exposure 曝光充分
·Intimate phototool and dry film contact 底片與干膜緊密結(jié)合
·Adequate exposing energy/time 適當(dāng)?shù)钠毓饽芰?時間
·Good dry film adhesion to copper foil 良好的干膜與銅面粘接
·Tight chemistry controls on develop/etch/strip lines
顯影/蝕刻工序中嚴(yán)格的化學(xué)控制
·Good fluid spray patterns 好的噴淋顯影點控制
·Reduced copper foil thickness 減少銅箔厚度
Coretec production capability is presently 5 mil line/5 mil space(+/- 1 mil), commonly in 1/2 to 1 oz copper.
目前一般的生產(chǎn)能力：銅箔厚度0.5或10OZ;5mil線寬，5mil線距(+/-mil)
9. Inner-layer Oxide: This process is designed to intentionally create a coating of copper oxide onto the copper circuitry to enhance the surface topography. This will increase the bond strength between the core and the bonding materials used in the multi-layer laminateon.
內(nèi)層黑化：為提高銅表面與預(yù)浸材料之間在層壓后的結(jié)合力所采用的氧化處理工藝。對銅表面進行化學(xué)氧化(黑化)，使其表面生成一層氧化物(黑色的氧化銅或棕色的氧化亞銅或兩者的混合物)，以進一步增加比表面，提高粘結(jié)力。
ii) Multilayer 層壓
Vacuum Press Lamination: Lamination is the process of bonding cores together to form a multi-layer panel. Lnner-layer oxidized cores are stacked up with prepreg and copper foils, depending on the type of build. Multi-layers are laminated using a Hydraulic Press.
Coretec utilizes a Vacuum Assisted Hydraulic Press which improves resin flow and increases moisture/volatiles removal. The press utilizes an automatic cure cycle control which supplies heat/pressure/vacuum. The presses are coupled with a controlled cooling cycle under pressure to reduce warpage.
層壓是借助于B-階粘結(jié)片把各層線路薄板(內(nèi)層、半固化片、銅箔)粘結(jié)成一整體的一個生產(chǎn)過程。層壓機可以分為非真空液壓和真空壓機。
真空層壓易于樹脂流動量，不易出現(xiàn)白班或裂紋。真空壓機通過制動加熱循環(huán)控制系統(tǒng)，提供熱量/壓力/真空度，壓機通過冷卻控制系統(tǒng)在一定壓力下進行板冷卻，減小翹曲發(fā)生。
iii) NC Drilling 數(shù)控鉆孔
Panels arriving from the vacuum press will be drilled to create interconnections between the different layers of the circuitry.
The drills are CNC controlled and receive files from CAM which contain the number of hits, hole sizes, and the path for the drill head to follow.
層壓后到鉆孔工序進行孔加工，使各層線路間形成網(wǎng)絡(luò)連接。
數(shù)控鉆機從CAM中接受數(shù)據(jù)文件，包括鉆孔數(shù)、孔大小及鉆孔路徑。
·Panels from the lamination presses are first routed and edge beveled to clean up the edges of the panels. The tooling holes are spot faced to allow the panels to lie flat on the drill table.
層壓后先裁連，以使板連平整。銑出定位孔處的銅箔，用沖孔機沖出定位孔。
Panels are drilled typically in stacks of 3 high + entry foil & backup material.
一般是鉆3個定位孔。
·Larger drills may process 4-5 panel stacks simultaneously.
大孔可以4-5疊板同時鉆。
·Tool management system provides storage for up to 120 drills per spindle, automatic tool change when maximum hits reached.
鉆刀庫可以存放120把刀每個鉆軸，在鉆孔時可以自動的更換鉆刀。
·Drill ROM and plunge speed are automatically adjusted for each drill size.
鉆速與進給速度根據(jù)鉆刀大小來調(diào)節(jié)。
·Typical panels have 10000-12000 holes (some as much as 30K).Takes approx. 1 hour to process.
一般的板要鉆10000-12000個孔(最多可達到3萬)，大約需鉆一個小時。
·Panels are checked with X-Rays for hole Registration in inner-layers.
Introduction of scale factor may be necessary to center drill pattern to copper pattern.
X-Ray機可以測量內(nèi)層上的孔位置精度，通過漲縮系數(shù)的調(diào)整是必要的，可以使鉆孔與導(dǎo)體圖形對正。
·Smallest drill hole capability is 13.5 mil diameter with a drill aspect ratio of 6:1.
最小能鉆直徑直徑為13.5mil的孔，最小板厚孔徑為6：1。
Deburring As drill removes copper a small copper ridge forms around the hole edge. The burr is mechanically removed using scrubbing brushes and high pressure water blast to remove any debris from the holes.
去毛刺-鉆孔后會在銅箔和孔壁上產(chǎn)生粗糙邊。用機械方法(通常是用旋轉(zhuǎn)的、含磨料的尼龍刷輥及高壓水流水洗)去除毛刺。
iv) Electroless Crpper 沉銅
Desmear: Friction during drilling causes the drill to heat-up and melt the resin between copper layers. As the drill is removed. The soft resin will smear across internal conductors. The smeared resin will prevent electrical connect on to innerlayers, it must be removed by chemical or plasma attack. Coretec utilizes a chemical permanganate desmear process.
Etchback: Some specifications require electrical connection to three surfaces on internal conductors, hence in addition to desmear, additional resin and glass fibre must be relieved from the hole wall to allow access to three side of internal conductors. This is know as “positive etchback”. Usually a military-only requirement.
除膠：鉆孔時的磨擦使鉆刀升溫，使得孔內(nèi)板材中的樹脂熔化。隨著鉆刀的移動，熔化的樹脂會粘污到內(nèi)層的導(dǎo)線上。因其妨礙內(nèi)層連接的可靠性，所以必須用化學(xué)(高錳酸鉀)或等電子方法清除。
凹蝕：某些標(biāo)準(zhǔn)要求內(nèi)層銅的三面都同電鍍銅層連接，因此通過除膠過程可以將樹脂和玻璃纖維從孔壁上咬蝕掉一部分，使鍍層與內(nèi)層達到三面聯(lián)接的效果，這常常叫做“正凹蝕”，通常軍標(biāo)也提出類似要求。
Electroless Copper is a chemical metalization process intended to metallize the surface of dielectric material at the hole wall and institute electrical connection between all exposed copper surfaces. The process deposits a very thin(75 micro-inches), fragile coating of pure copper over the entire surface of the panel, this includes the drilled hole walls and the external surfaces.
化學(xué)沉銅：為了使孔壁上不導(dǎo)電的樹脂及玻璃能夠?qū)щ�，進行化學(xué)沉銅，使孔壁與板面上沉上的一層很薄的銅層，只有大約75微英寸厚(0.5mil)，再通過全板電鍍，使板面和內(nèi)層銅聯(lián)接起來。
v) External Imaging 外光成像
Dry Film Lamination: Just as in inner layer, photosensitive dry-film is laminated on both sides of the panel.
貼干膜：與內(nèi)層相同，將干光性干膜帖覆在兩邊板面上。
Dry Film Exposure: A positive image is used to create a negative(reverse) image of the external circuitry onto the dry-film, note that the dark areas of the artwork cover the panel holes. The film and the artwork are exposed to UV light and the external image is created.
曝光：用正像的菲林產(chǎn)生負(fù)像的線路圖形，菲林上黑色圖形區(qū)域?qū)迕嫔系目赘采w，菲林與干膜經(jīng)紫外光曝光后產(chǎn)生圖形。
Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a “channel”for copper pattern plating to take place.
顯影：干膜上未被曝光的部分被顯影藥水溶解，于是在干膜面上出現(xiàn)溝槽，經(jīng)過圖形電鍍將形成“圖形”。
vi) Wet Processes 濕流程
Copper Plating: Copper is electrodeposited onto the copper foil that is outlined by the dry film. Copper is plated on the surface and in the holes of the panel. The panels are suspended in an acid-copper bath along with copper anode balls. Current from a DC rectifier drives copper to be consumed from the anodes and deposited on the plated surfaces. Organic compounds are also introduced to the plating baths to control deposition rates.
Tin plating: Immediately after copper plating, a thin layer(0003”) of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process.
鍍銅：圖形轉(zhuǎn)移完成后將進行圖形電鍍。在表面線路與孔壁都鍍上一層銅。簡單的介紹電鍍過程：將板侵入裝有銅陽級的酸性溶液中，在直流電流作用下，銅離子離開銅陽極表面，沉積到板面線路與孔壁上，鍍銅缸內(nèi)加入了添加劑以控制銅離子的沉積速率。
鍍錫：鍍銅后在銅表面再鍍上一層錫，大約3mil厚，在下工序中起到抗蝕保護線路的作用。
Dry Film Strip: Removes the plating resist exposing the base copper underneath. The plated copper remains, protected by the tin plating etch resist.
去膜：蝕刻后露出的銅箔被蝕去，留下鍍上錫保護的線路部分。]
Copper Etch: The exposed copper is removed through an etching process, while the plated tin acts as a resist-protecting the plated copper from the etchant.
去錫：除去鍍錫層，顯現(xiàn)出線路部分的銅線。(銅線由三層構(gòu)成：基銅層、沉銅層和電鍍銅層)
vii) Soldermask 阻焊
Solder mask on Bare Copper(SMOBC): Solder mask is an insulative protective coating that is applied to the external circuitry after the SES process. Soldermask serves two purposes:
to electrically isolate copper features on the surface of the board.
to protect the coated copper from mechanical and environmental damage.
Coretec uses only liquid photoimageable soldermask(LPISM)for best resoluteion and ease of processing. Other processes(dry film, silkscreen)less common. Semi-gloss is standard, matte finishes also available.
PISM must be used in conjunction with “button print” operation to plug via holes.
裸銅覆阻焊膜工藝(SMOBC)：是一種保護層，涂覆在板不需焊接的線路和基材上，目的是防止焊接時線路間產(chǎn)生橋接，同時保護線路圖形在機械和化學(xué)環(huán)境安全。
使用液態(tài)光成像阻焊效果好，也容易處理，其他的保護層如干膜和熱固油墨等使用較少，另外啞光油墨(不光澤、不光滑的)也有一部分使用。
塞孔技術(shù)使用“點圖”將導(dǎo)通孔塞住。
Photoimageable Soldermask Application: 工藝要點
1. Surface Cleaning: Removes oxide and contaminants by AlO2 scrubbing the panel.
表面清潔處理：去除板面氧化膜、污物，通常使用氧化鋁粉磨板機處理。
2. Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
網(wǎng)�。涸诎鍍擅嫱耆扛沧韬赣湍▽�(dǎo)通孔、焊盤。
3. Tack Dry: evaporate the mask solvents and cure the mask sufficiently to be handled in exposure step.
預(yù)烘：預(yù)烘的目的是使阻焊層進行熱固化，有利與曝光一步的處理。
4. Exposure: PISM acts similarly to a Dry-Film, a negative artwork is used to create the image of the solderable are as like SMT pads, PTH. The solder mask is exposed to UV light in a controlled environment such as in inner or outer-layer.
曝光：使用負(fù)性菲林圖形，將焊盤、SMT和孔位擋住，未擋住的油墨受紫外光照射后，發(fā)生光固化。
5. Develop: The unexposed PISM is developed away, leaving the solderable pads exposed.
顯影：未曝光的部分阻焊膜顯影時除去，已曝光部分留存。
6. Thermal Cure: The panels go through a controlled cure cycle(300 deg F)to haren the soldermask and make it a permanent board finish.
固化：固化的目的是使阻焊膜完全硬化交聯(lián)，在140-150℃烘箱中40-60分鐘即完成。
Printed Circuit Board ENGLISH Training
